Dholera: Commencing in December 2026, the inaugural batch of semiconductors will emanate from Tata Electronics’ facility located herein, as announced by Union Minister for Communications and IT, Ashwini Vaishnaw, on Wednesday.
Addressing attendees at the commencement ceremony of the chip plants initiated by Tata Group and CG Power, Vaishnaw asserted that India is poised to ascend among the top five chip ecosystems globally by 2029.
“In the inaugural month of December 2026, the inaugural chip from the Dholera facility will be released, with the Micron plant following suit in December 2024,” articulated the minister.
Elaborating further, he elucidated that Tata’s Dholera facility will engage in chip production within the 28, 50, and 55 nanometer node spectrum. Prime Minister Narendra Modi laid the groundwork for three chip plants, encompassing two units by Tata Electronics and the third by CG Power, with a cumulative investment of Rs 1.26 lakh crore.
These establishments include India’s maiden state-of-the-art chip manufacturing facility by Tata Electronics, in collaboration with Taiwan’s Powerchip Semiconductor Manufacturing Corp, situated within Dholera’s exclusive industrial precinct.
The facility is slated to boast a capacity of producing 50,000 wafers monthly, requiring an investment of Rs 91,000 crore, with the Center contributing 50 percent of the capital expenditure on a pari passu basis.
These technologically advanced chips will serve diverse sectors, including power management for electric vehicles (EVs), telecommunications, defense, automotive, consumer electronics, display, and power electronics.
Semiconductors stand as a cornerstone industry permeating myriad facets of life, empowering appliances ranging from refrigerators to air conditioners, and from automobiles to aircraft and trains.
Furthermore, the Prime Minister laid the foundation stone for another assembly and testing facility by Tata Electronics in Jagiroad, Assam.
With an investment outlay of Rs 27,000 crore, Tata’s Assam facility is anticipated to foster over 27,000 direct and indirect employment opportunities in the region.
Significantly, this marks India’s inaugural semiconductor unit in the Northeast. Tata Semiconductor Assembly and Test (TSAT) will spearhead the development of indigenous advanced semiconductor packaging technologies, encompassing flip chip and ISIP (integrated system in package) technologies, with a daily capacity of 48 million chips.
The targeted segments include automotive, electric vehicles, consumer electronics, telecommunications, and mobile phones, among others. Additionally, the Prime Minister inaugurated CG Power’s semiconductor unit, established in partnership with Renesas Electronics Corp and Stars Microelectronics of Thailand, situated at Sanand in Gujarat, with an investment of Rs 7,600 crore.
Renesas, a premier semiconductor company, specializes in niche chips, boasting 12 semiconductor facilities and playing a pivotal role in microcontrollers, analog, power, and system-on-chip products.
The facility is poised to churn out 15 million chips daily, catering to consumer, industrial, automotive, and power applications.
Vaishnaw emphasized ongoing endeavors to establish a semiconductor industry in India since 1962, which have now come to fruition.
He lauded the groundbreaking ceremony for three substantial semiconductor ventures as unprecedented globally. “The groundbreaking ceremony was conducted within 15 days of project approval by the Center. India is on track to emerge among the top five semiconductor ecosystems by 2029,” affirmed Vaishnaw.
Chairman of Tata Sons, N Chandrasekaran, highlighted that Tata Electronics’ semiconductor projects will initially engender 50,000 direct and indirect employments.
He projected the commencement of operations at the Assam facility prior to the commencement of production at the Dholera fabrication unit.